Murray Associates of Utica (MAU) is seeking a self-motivated Electrical Engineer to join our team in Rome, New York. The successful candidate will work as part of a multidisciplinary team of engineers, physicists, and technical professionals developing complex solutions in support of advanced quantum networking technologies.

As a member of the Quantum Engineering team, you will contribute to the design, development, fabrication, testing, and execution of experimental electrical and electronic systems. This position requires the ability to apply engineering and scientific principles to analyze and resolve complex technical challenges with limited supervision.

The ideal candidate is detail-oriented, creative, adaptable, and comfortable working in a research and development environment. Strong written and verbal communication skills are essential, as the position includes preparing technical reports, documentation, and presentations related to quantum networking experiments and associated engineering activities.

Successful team members actively collaborate, communicate effectively, consider diverse perspectives, and demonstrate a willingness to learn new technologies and work outside their traditional areas of expertise.

• Design, build, and execute quantum technology-based experiments at customer facilities and provide engineering support throughout all phases of experimentation.
• Contributes to quantum networking experiments, including experimental design, system setup, data collection, analysis, troubleshooting, and interpretation of results.
• Design, modify, fabricate, and test prototype printed circuit boards (PCBs) using available design and fabrication systems to support customer and experimental requirements.
• Develop PCB designs based on customer requirements, experimental objectives, and prototype semiconductor device interfaces.
• Perform manual and automated wire bonding of PCBs used to test photonic and superconducting semiconductor devices.
• Support the electrical packaging and interfacing of prototype semiconductor, photonic, and related experimental devices.
• Assist with the integration of electrical, electronic, optical, and mechanical components into experimental systems.
• Develop 3D CAD models and assemblies, as needed, for prototype components, PCB mounting systems, custom cryostat hardware, fiber-handling systems, optical components, and other specialized experimental hardware.
• Perform root cause analysis, troubleshooting, and testing of electrical and electronic components and systems and implement necessary design modifications.
• Assist with the layout and integration of optical laser breadboard systems and associated electronic instrumentation.
• Support fiber-optic systems, including fiber coupling and interfacing with waveguide and photonic devices.
• Develop or support automated methods for experimental data collection, organization, and analysis.
• Prepare technical reports, presentations, drawings, schematics, and other documentation related to engineering activities and experimental results.
• Perform additional duties and responsibilities as assigned.

Minimum Qualifications

• Bachelor’s degree or higher in Electrical Engineering or a closely related engineering or technical field.
• Experience designing, fabricating, testing, or integrating prototype systems or components in a research, development, laboratory, or similar technical environment.
• Demonstrated understanding of electrical and electronic systems and engineering principles.
• Strong analytical, problem-solving, and troubleshooting skills.
• Ability to clearly communicate complex technical concepts through written documentation and presentations.
• Ability to work effectively both independently and as part of a multidisciplinary technical team.
• Must be a U.S. citizen.

Preferred Qualifications
Experience or familiarity with one or more of the following:

• Printed circuit board design, modification, fabrication, and testing.
• Electrical interfacing and packaging of prototype semiconductor devices.
• Manual and automated wire bonding.
• TPT HB10 and/or F&S Bondtec 5630 wire bonding systems.
• Photonic or superconducting semiconductor devices.
• Fiber optics and fiber-optic systems.
• Fiber coupling to waveguide or photonic devices.
• Electrical test equipment, instrumentation, and laboratory measurement systems.
• Prototype fabrication and rapid system development.
• Python, Jupyter Notebook, or similar software development and data-analysis environments.
• Automated experimental data acquisition, processing, and analysis.
• 3D CAD modeling and assembly design.
• Development of 2D engineering drawings.
• Additive manufacturing and 3D printing.
• Autodesk Fusion 360.
• Formlabs Form 3 and/or Form 4 3D printers.

Desired Candidate Attributes
The successful candidate will demonstrate:

• Strong attention to detail and commitment to high-quality work.
• Creativity and an ability to develop practical solutions to complex engineering problems.
• Ability to manage priorities and deliver work in accordance with project expectations and schedules.
• Initiative and the ability to work effectively with minimal guidance.
• Willingness to learn new technologies and expand beyond established areas of expertise.
• Strong written, verbal, and presentation skills.
• A collaborative approach and respect for differing technical perspectives and ideas.